Journal
| Title | Interference of coexisting copper and aluminum on the ammonium thiosulfate leaching of gold from printed circuit boards of waste mobile phones. Posted by Carlito Tabelin |
| Authors | Jeon S., Tabelin C.B., Takahashi H., Park I., Ito M. and Hiroyoshi N. |
| Publication date | 2018 |
| Journal | Waste Management |
| Volume | 81 |
| Pages | 148-156 |
| Publisher | Elsevier |
| DOI | https://doi.org/10.1016/j.wasman.2018.09.041 |